Fibocom Launches the Industry-first SC151-GL at MWC Shanghai 2023, Accelerating the Global 5G AIoT Commercialization with One Highly Integrated Smart Module
(Adnkronos) – During MWC Shanghai 2023, Fibocom announces the launch of its 5G smart module SC151-GL empowered by the Qualcomm® QCM4490 Processor. The global version of SC151-GL aims to provide a “one
